SK hynix is showcasing its cutting-edge artificial intelligence memory technologies at Nvidia’s GPU Technology Conference (GTC) in San Jose, California, highlighting collaborative solutions developed with Nvidia. The event, taking place Monday through Thursday, is a premier global forum for AI and accelerated computing, bringing together leading technology companies, developers, and researchers to discuss the latest innovations and industry trends.
“SK hynix provides memory products that are integrated into Nvidia’s AI infrastructure, minimizing data bottlenecks and maximizing performance in AI training and inference,” stated an SK hynix representative.
“Through GTC, we aim to demonstrate our competitive edge in memory technologies, a fundamental aspect of the AI era, built upon our strong partnership with Nvidia.”
Under the theme “Spotlight on AI Memory,” SK hynix’s booth is divided into three zones: the Nvidia Collaboration Zone, the Product Portfolio Zone, and the Event Zone. These zones are designed to provide visitors with a comprehensive understanding of the crucial role memory plays in AI systems.
The Nvidia Collaboration Zone focuses on the successful collaboration between SK hynix and Nvidia. Here, SK hynix is presenting its memory products, including the sixth-generation HBM4, fifth-generation HBM3E chips, and SOCAMM2, and demonstrating their application across Nvidia’s AI platforms.
Demonstrations showcase the memory configurations used in GPU-based AI accelerators through physical displays and models. Additionally, a liquid-cooled eSSD, jointly developed with Nvidia, is on display, alongside DGX Spark, Nvidia’s AI supercomputer equipped with SK hynix’s LPDDR5X memory.
The Product Portfolio Zone introduces SK hynix’s broader range of AI-focused memory solutions. The company is exhibiting HBM4 and HBM3E, essential components of AI infrastructure, alongside high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and automotive solutions for next-generation AI applications.
In the Event Zone, SK hynix is hosting an engaging HBM 16-layer stacking game. Inspired by the layered structure of high-bandwidth memory, this interactive activity allows participants to virtually stack memory chips, providing insights into TSV processes and advanced high-layer packaging technologies used in high-performance AI semiconductors.
During the conference, SK Group Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung are scheduled to meet with executives from leading global tech companies to discuss AI technological advancements and the evolving structure of AI infrastructure, as well as potential medium- to long-term collaborations.
SK hynix will also participate in technical sessions to delve into the future of AI-driven manufacturing and the vital role of advanced memory technologies in enabling high-performance AI systems.
“As AI technologies continue to advance, memory is becoming a critical factor shaping the architecture and overall performance of AI infrastructure,” the SK hynix official commented. “With our wide-ranging memory capabilities, from data centers to on-device AI, we are committed to collaborating with global partners to build the future of AI.”
yeeun
