Hanwha Semitech announced the development of its second-generation hybrid bonder, a crucial technology for advancing next-generation semiconductor packaging. The company plans to ship the equipment to clients for performance evaluation in the first half of this year.
Hybrid bonders are recognized as vital for improving the performance and manufacturing efficiency of high-bandwidth memory (HBM), a key component in AI accelerators.
The South Korean semiconductor equipment manufacturer stated that the new system, named SHB2 Nano, features ultra-precise alignment technology with a minimal positioning error of 0.1 micrometers. Hanwha Semitech previously delivered its first-generation hybrid bonder to customers in January 2022.
This advanced technology directly bonds chips onto copper surfaces without the use of bumps, creating a near-zero gap between them. This enables faster data transfer, a more compact design, and reduced power consumption compared to traditional packaging techniques.
Hanwha Semitech believes the successful development of the second-generation system positions them to introduce mass production equipment to the market soon.
“Through continuous investment in cutting-edge technologies, we have overcome the technical hurdles associated with hybrid bonding and brought the product closer to widespread adoption,” stated an official from Hanwha Semitech.
Hanwha’s development coincides with a growing trend among major memory chip suppliers towards hybrid bonding for next-generation HBM products, which utilize vertical stacking of DRAM dies to boost performance.
During its January earnings call, Samsung Electronics revealed that it had implemented hybrid bonding in its HBM4, delivered samples to key clients in the preceding quarter, and initiated discussions. The company also mentioned plans for limited commercialization at the HBM4E stage.
In addition to its hybrid bonder equipment, the company is also focusing on strengthening its presence in the thermal compression (TC) bonder market.
The equipment maker reported that its TC bonder SFM5 Expert generated over 90 billion won ($68 million) in sales last year. The company also announced securing two supply contracts in January and February.
Hanwha Semitech reported a return to profitability in the fourth quarter of 2025, approximately one year after officially delivering a TC bonder to customers in March 2025.
The company is also actively developing second-generation TC bonders for the next-generation HBM equipment market, including models featuring larger bonding heads and fluxless TC bonders designed to minimize chip-to-chip spacing.
