SK hynix initiated a significant expansion with the groundbreaking ceremony Wednesday for its P&T7 advanced packaging facility in Cheongju, North Chungcheong Province. This state-of-the-art semiconductor fab is strategically designed to focus on advanced packaging for next-generation AI memory solutions, including crucial high-bandwidth memory (HBM), which is vital for enhancing AI performance. The ambitious project, valued at approximately 19 trillion won ($13.7 billion), will be constructed on an expansive 230,000-square-meter site, featuring a substantial cleanroom area of roughly 150,000 square meters. This investment underscores SK hynix’s commitment to leading the evolving AI semiconductor and memory landscape. (SK hynix)
